Kingston’s KSM26ES8/16MF 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM
Kingston’s KSM26ES8/16MF 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM
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Description
Kingston’s KSM26ES8/16MF 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM
| Parameter | Specification |
|---|---|
| CAS Latency (CL / IDD) | 19 cycles |
| Row Cycle Time (tRCmin) | 45.75 ns (min) |
| Refresh to Active / Refresh Command Time (tRFCmin) | 350 ns (min) |
| Row Active Time (tRASmin) | 32 ns (min) |
| Maximum Operating Power | * |
| UL Rating | 94 V-0 |
| Operating Temperature | 0 °C to +85 °C |
| Storage Temperature | −55 °C to +100 °C |
| Supported Data Rates | PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600 |
| Power Supply – VDD | 1.2 V Typical |
| Power Supply – VDDQ | 1.2 V Typical |
| Power Supply – VPP | 2.5 V Typical |
| Power Supply – VDDSPD | 2.2 V to 3.6 V |
| Rank | Single-Rank |
| Internal Banks | 16 (4 groups × 4 banks) |
| On-Die Termination (ODT) | Nominal & dynamic for data, strobe, and mask signals |
| Data Bus Inversion | Supported (DBI) |
| VREFDQ | On-die generation and calibration |
| Power Saving | Low-Power Auto Self Refresh (LPASR) |
| Burst Length | BC4 (Burst Chop 4) and BL8 |
| Burst Selection | BC4 or BL8 selectable on-the-fly (OTF) |
| Topology | Fly-by topology |
| Command/Address Bus | Terminated control, command, and address bus |
| SPD | On-board I²C SPD EEPROM |
| Temperature Monitoring | Integrated temperature sensor with SPD |
| PCB Height | 1.23 in (31.25 mm) |
| Compliance | RoHS Compliant, Halogen-Free |
Additional information
| Brand | Kingston |
|---|
